Apparatus and method for polishing metal layer using photolysis advanced oxidation process

摘要

An apparatus and a method for chemically mechanically polishing a metal film using a photolysis advanced oxidation process (AOP) are disclosed. The metal film polishing method includes the steps of: irradiating a chemical-mechanical polishing slurry containing ozone (O ₃ ) with ultraviolet light to generate an OH radical; Contacting the chemical-mechanical polishing slurry composition with the OH radical generated with a substrate having a metal film formed thereon; And polishing the metal film by moving the metal film oxidized by the OH radical with respect to the polishing pad, wherein the ozone (O ₃ ) reacts with the water of the chemical-mechanical polishing slurry, OH radical is generated.