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The flat rail structure located in the adjacent metal layer.

机译:平轨结构位于相邻的金属层中。

摘要

The first metal layer of semiconductor Dips consists of a plural metal line extended by the first axis, and a first rail structure extended by the first line.The first rail structure is physically separated from the first metal line.The second metal layer is located on the first metal layer.The second metal layer includes the second line directly crossed on the first axis, the second metal line and the second line extended respectively, and the second rail structure extended.The second rail structure is physically separated from the second metal line.The second rail structure is located on the first rail structure.The revenge Biya lies between the first and second metal layers.Vivian serves three people to connect the first track structure to the second track structure.
机译:半导体Dips的第一金属层由沿第一轴延伸的多条金属线和由第一线延伸的第一轨道结构组成,第一轨道结构与第一金属线物理分离,第二金属层位于第二金属层包括在第一轴线上直接交叉的第二线,分别延伸的第二金属线和第二线,以及延伸的第二轨道结构。第二轨道结构与第二金属线物理分离。第二条铁路结构位于第一条铁路结构上,复仇比亚号位于第一和第二金属层之间,维维安(Vivian)为三个人提供服务,将第一条轨道结构连接到第二条轨道结构。

著录项

  • 公开/公告号KR103490000B1

    专利类型

  • 公开/公告日2019-07-15

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20170125212

  • 申请日2017-09-27

  • 分类号H01L21/768;

  • 国家 KR

  • 入库时间 2022-08-21 11:48:10

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