首页> 外国专利> APPARATUS OF JOINING SUBSTRATES FOR ELECTROWETTING DISPLAY PANEL AND METHOD OF JOINING SUBSTRATES FOR ELECTROWETTING DISPLAY USING THE SAME

APPARATUS OF JOINING SUBSTRATES FOR ELECTROWETTING DISPLAY PANEL AND METHOD OF JOINING SUBSTRATES FOR ELECTROWETTING DISPLAY USING THE SAME

机译:用于电子显示面板的接合基体的装置和使用该方法的用于电子显示面板的接合基体的方法

摘要

In the substrate bonding apparatus for bonding the first substrate and the second substrate for the electrowetting display panel to each other, the substrate wetting apparatus for the electrowetting display panel according to the present invention includes a first chuck having a first support surface, and the first chuck. And a second chuck having a second support surface facing the support surface and disposed below the first chuck. In the plan view, the second support surface is located inside the first support surface and has a smaller size than the first support surface.
机译:在用于将第一基板和第二基板用于电润湿显示面板彼此接合的基板接合装置中,根据本发明的用于电润湿显示面板的基板润湿装置包括具有第一支撑表面的第一卡盘和第一卡盘。第二卡盘具有第二支撑表面,该第二支撑表面面对支撑表面并设置在第一卡盘的下方。在平面图中,第二支撑表面位于第一支撑表面的内部,并且具有比第一支撑表面小的尺寸。

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