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APPARATUS OF JOINING SUBSTRATES FOR ELECTROWETTING DISPLAY PANEL AND METHOD OF JOINING SUBSTRATES FOR ELECTROWETTING DISPLAY USING THE SAME
APPARATUS OF JOINING SUBSTRATES FOR ELECTROWETTING DISPLAY PANEL AND METHOD OF JOINING SUBSTRATES FOR ELECTROWETTING DISPLAY USING THE SAME
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机译:用于电子显示面板的接合基体的装置和使用该方法的用于电子显示面板的接合基体的方法
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摘要
In the substrate bonding apparatus for bonding the first substrate and the second substrate for the electrowetting display panel to each other, the substrate wetting apparatus for the electrowetting display panel according to the present invention includes a first chuck having a first support surface, and the first chuck. And a second chuck having a second support surface facing the support surface and disposed below the first chuck. In the plan view, the second support surface is located inside the first support surface and has a smaller size than the first support surface.
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