METHOD AND APPARATUS OF POLISHING SINGLE-SIDE OF SINGLE SEMICONDUCTOR WAFER

摘要

(Problem) Provided is a single-sided single-side polishing method and a single-sided single-side polishing apparatus capable of increasing flatness of a semiconductor wafer and suppressing variations in flatness. (Solving means) The single wafer polishing method of the semiconductor wafer of the present invention includes a polishing step of pressing the semiconductor wafer 1 held by the polishing head 120 with the surface plate 140 to polish the semiconductor wafer 1; The semiconductor wafer 1 held by the polishing head 120 is conveyed from the surface plate 140 onto the tray 190 outside the surface plate, and then the semiconductor wafer 1 is separated from the polishing head 120, thereby leaving the tray 190. ), The relative position of the mounted semiconductor wafer 1 and the polishing head 120 is moved in the rotational direction of the polishing head 120, and then the placed semiconductor wafer 1 is placed thereon. ) A positioning step of holding by the polishing head 120, wherein the polishing step is performed a plurality of times, and the positioning step is performed at least one time during the plurality of polishing steps.