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Continuous furnace and die bonder with a continuous furnace.
Continuous furnace and die bonder with a continuous furnace.
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机译:连续炉和带有连续炉的芯片粘接机。
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摘要
The invention relates to a continuous furnace comprising a furnace body (2) and a cover (6), which enclose a channel through which substrates can be transported and to which a working gas can be supplied. The cover (6) has at least one process opening. Connecting points between individual parts of the continuous furnace, which are detachably connected to each other, are formed with opposite joining surfaces (11, 12). At least some of the connection points have a groove (15) which can be acted upon with negative pressure during operation. By the unavoidable gap between the joining surfaces (11, 12) penetrating air is sucked through the groove (15) and does not get into the furnace interior. The invention further relates to a die bonder with such a continuous furnace.
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