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Continuous furnace and die bonder with a continuous furnace.

机译:连续炉和带有连续炉的芯片粘接机。

摘要

The invention relates to a continuous furnace comprising a furnace body (2) and a cover (6), which enclose a channel through which substrates can be transported and to which a working gas can be supplied. The cover (6) has at least one process opening. Connecting points between individual parts of the continuous furnace, which are detachably connected to each other, are formed with opposite joining surfaces (11, 12). At least some of the connection points have a groove (15) which can be acted upon with negative pressure during operation. By the unavoidable gap between the joining surfaces (11, 12) penetrating air is sucked through the groove (15) and does not get into the furnace interior. The invention further relates to a die bonder with such a continuous furnace.
机译:连续炉技术领域本发明涉及一种连续炉,其包括炉体(2)和盖(6),所述炉体和盖(6)封闭通道,基板可以通过该通道传输并且可以向其供应工作气体。盖(6)具有至少一个处理开口。连续炉的可拆卸地彼此连接的各个部分之间的连接点形成有相对的接合表面(11、12)。至少一些连接点具有凹槽(15),该凹槽在操作过程中可施加负压。通过接合表面(11、12)之间不可避免的间隙,穿透的空气通过凹槽(15)被吸入并且不会进入炉膛内部。本发明还涉及具有这种连续炉的芯片键合机。

著录项

  • 公开/公告号CH711296B1

    专利类型

  • 公开/公告日2019-03-15

    原文格式PDF

  • 申请/专利权人 BESI SWITZERLAND AG;

    申请/专利号CH20150000980

  • 发明设计人 GUIDO SUTER;DANIEL ANDREAS SCHERER;

    申请日2015-07-07

  • 分类号F27B9/20;H01L21/58;

  • 国家 CH

  • 入库时间 2022-08-21 11:45:40

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