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Continuous furnace and die bonder with a continuous furnace

机译:连续炉和带有连续炉的芯片粘接机

摘要

Continuous furnace, comprising a furnace body (2) and a cover (6) which enclose a channel through which substrates can be transported and to which a working gas can be fed, the cover (6) having at least one process opening (10), the furnace body (2) and the cover (6) comprise one or more individual parts that are detachably connected to one another, connecting points between the individual parts are designed as flat connections with mutually opposite joining surfaces (11, 12), and at least some of the connecting points have a groove (13 , 15,20, 22).
机译:连续炉,包括炉体(2)和盖(6),该炉体封闭通道,基板可以通过该通道传输并且可以向其输送工作气体,该盖(6)具有至少一个处理口(10)炉体(2)和盖(6)包括一个或多个彼此可拆卸地连接的独立部件,各个部件之间的连接点设计为具有彼此相对的接合表面(11、12)的扁平连接,并且至少一些连接点具有凹槽(13、15、20、22)。

著录项

  • 公开/公告号DE102016112070B4

    专利类型

  • 公开/公告日2020-10-29

    原文格式PDF

  • 申请/专利权人 BESI SWITZERLAND AG;

    申请/专利号DE201610112070

  • 发明设计人 DANIEL ANDREAS SCHERER;GUIDO SUTER;

    申请日2016-07-01

  • 分类号F27B9/14;F27B9/30;

  • 国家 DE

  • 入库时间 2022-08-21 11:02:05

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