WAFEREBENE INTEGRATED MEMS COMPONENT; THIS IS ENABLED WITH A SILICON COLUMN AND AN INTELLIGENT CAP

摘要

The present invention relates to a MEMS package (MEMS: microelectromechanical system) and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer wafer bond level. A device substrate having first and second MEMS devices is bonded to a capping substrate having first and second recessed areas. A ventilation trench is laterally spaced from the recessed areas and located in the second cavity. A seal structure is disposed in the vent trench or defines a vent that is fluidly coupled to a second cavity. A cap is disposed in the vent opening to seal the second cavity with a second gas pressure that differs from a first gas pressure of the first cavity.