A conveying mechanism for requesting a wafer unit having a wafer disposed and supported in and on an annular frame by a tether includes a housing carrier housing the wafer unit therein, and a transport unit that carries and transports the housing carrier between wafer processing devices. The housing support includes a ceiling plate and a lower plate connected by a pair of sidewalls facing each other via an opening formed in a side through which the wafer unit can be taken into and out of the housing support. An airflow generator is formed on the ceiling panel for generating air outflows in the housing support directed from the ceiling panel into the opening. The transport unit individually conveys wafer units between the wafer processing devices.
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