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FUNDING MECHANISM

机译:筹资机制

摘要

A conveying mechanism for requesting a wafer unit having a wafer disposed and supported in and on an annular frame by a tether includes a housing carrier housing the wafer unit therein, and a transport unit that carries and transports the housing carrier between wafer processing devices. The housing support includes a ceiling plate and a lower plate connected by a pair of sidewalls facing each other via an opening formed in a side through which the wafer unit can be taken into and out of the housing support. An airflow generator is formed on the ceiling panel for generating air outflows in the housing support directed from the ceiling panel into the opening. The transport unit individually conveys wafer units between the wafer processing devices.
机译:一种用于请求晶片单元的传送机构,该晶片单元具有通过系绳布置并支撑在环形框架中和上的晶片,该传送机构包括:在其中容纳晶片单元的壳体托架;以及在晶片处理装置之间承载和输送壳体托架的输送单元。壳体支撑件包括顶板和下板,该顶板和下部板通过形成在侧面中的开口彼此相对的一对侧壁连接,通过该侧面可以将晶片单元取入壳体支撑件和从壳体支撑件中取出晶片单元。在顶板上形成气流发生器,用于在壳体支撑件中产生从顶板指向开口的空气流出。输送单元在晶片处理装置之间分别输送晶片单元。

著录项

  • 公开/公告号DE102019205588A1

    专利类型

  • 公开/公告日2019-10-24

    原文格式PDF

  • 申请/专利权人 DISCO CORPORATION;

    申请/专利号DE201910205588

  • 发明设计人 KAZUNARI TANAKA;SATOSHI OHKAWARA;

    申请日2019-04-17

  • 分类号H01L21/677;H01L21/673;H01L21/48;B65G49/07;

  • 国家 DE

  • 入库时间 2022-08-21 11:44:24

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