首页> 外国专利> FIXING A CMS ON AN INSULATING LAYER WITH A SOLDER JOINT IN A CAVITY REALIZED IN AN INSULATING LAYER

FIXING A CMS ON AN INSULATING LAYER WITH A SOLDER JOINT IN A CAVITY REALIZED IN AN INSULATING LAYER

机译:在绝缘层中实现的型腔中,使用焊点在绝缘层上固定CMS

摘要

The invention relates to a method for fixing (S) a CMS on a printed circuit (10) comprising the following steps: - applying an insulating layer (20) (S1) on the printed circuit (10), - forming a cavity (22) in the insulating layer (20) above the conductive layer (12) (S2) of the printed circuit, - filling the cavity (22) with a soldering paste (3), - placing the CMS over it of the cavity (22) (S4), - applying a heat treatment (S5) to the printed circuit (10).
机译:本发明涉及一种将CMS固定(S)在印刷电路(10)上的方法,该方法包括以下步骤:-在印刷电路(10)上施加绝缘层(20)(S1),-形成空腔(22)。 )在印刷电路板导电层(12)(S2)上方的绝缘层(20)中-用焊膏(3)填充空腔(22),-将CMS置于空腔(22)上方(S4),-对印刷电路(10)进行热处理(S5)。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号