A surface-treated plated material is provided. The surface-treated plated material can suppress generation of whiskers, maintain good solderability and low contact resistance even when exposed to an elevated temperature environment, and have lower insertion force for terminals/connectors. The surface-treated plated material comprises a substrate provided with an upper layer, and the upper layer comprises a plated material containing Sn or In. A surface of the plated material contains at least one compound represented by a certain general formula and at least one compound represented by a certain general formula. One or more compounds selected from a group D of constituent compounds represented by certain general formulae are further applied onto a surface on the upper layer side.
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