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Polyimide alloy, polyimide alloy precursor resin composition, polyimide alloy precursor resin solution, and method for producing polyimide alloy

机译:聚酰亚胺合金,聚酰亚胺合金前体树脂组合物,聚酰亚胺合金前体树脂溶液以及聚酰亚胺合金的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a polyimide alloy capable of having sufficiently high heat resistance while having sufficiently high transparency. A polycondensation product of a cycloaliphatic tetracarboxylic dianhydride having an aliphatic 6-membered ring structure and at least one diamine compound selected from the group consisting of aromatic diamines and aliphatic diamines. A cycloaliphatic polyimide; and at least selected from the group consisting of diphenyl-3,3',4,4'-tetracarboxylic dianhydride and benzene-1,2,4,5-tetracarboxylic dianhydride. One aromatic tetracarboxylic dianhydride and a wholly aromatic polyimide which is a polycondensation product of an aromatic diamine; and the cyclic aliphatic polyimide and the cyclic aliphatic relative to the total amount of the wholly aromatic polyimide A polyimide alloy, wherein the content of the group polyimide is 62 to 95% by mass. [Selection diagram] None
机译:解决的问题:提供一种能够具有足够高的耐热性同时具有足够高的透明度的聚酰亚胺合金。具有脂族6元环结构的脂环族四羧酸二酐与至少一种选自芳族二胺和脂族二胺的二胺化合物的缩聚产物。脂环族聚酰亚胺;至少选自二苯基-3,3',4,4'-四羧酸二酐和苯-1,2,4,5-四羧酸二酐。一种芳香族四羧酸二酐和作为芳香族二胺的缩聚产物的全芳香族聚酰亚胺。相对于全部芳香族聚酰亚胺A的聚酰亚胺合金的总量,环状脂肪族聚酰亚胺和环状脂肪族化合物的含量为62〜95质量%。 [选择图]无

著录项

  • 公开/公告号JP2020125466A

    专利类型

  • 公开/公告日2020-08-20

    原文格式PDF

  • 申请/专利权人 JXTGエネルギー株式会社;

    申请/专利号JP20200010801

  • 发明设计人 小松 伸一;

    申请日2020-01-27

  • 分类号C08L79/08;C08G73/10;

  • 国家 JP

  • 入库时间 2022-08-21 11:37:45

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