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Filler filler and its manufacturing method, and high thermal conductive insulating material and its manufacturing method

机译:填充填料及其制造方法,高导热绝缘材料及其制造方法

摘要

PROBLEM TO BE SOLVED: To achieve both high thermal conductivity and high electrical insulation, which are contradictory to each other, at a high level. SOLUTION: The filler filler is composed of a mixed powder of a small diameter filler having a small average primary particle diameter D 1 and a large diameter filler having a large average primary particle diameter D 2 . The ratio D 1 / D 2 of the average primary particle diameter of the small diameter filler to the large diameter filler is 2 × 10 -4 to 3 × 10 -3 , and the volume resistivity of the mixed powder is 2 × 10 10 Ω · m or more. Is. Further, the mixing ratio of the small diameter filler is 0.5% by mass to 40% by mass with respect to 100% by mass of the mixed powder. Further, the small-diameter filler adheres to the outer peripheral surface of the large-diameter filler, and the small-diameter filler is connected in a beaded shape in the voids between the large-diameter fillers to form a three-dimensional network structure in the voids by the small-diameter filler. [Selection diagram] Fig. 1
机译:要解决的问题:在高水平上实现彼此矛盾的高导热性和高电绝缘性。 SOLUTION:填充料由平均直径D 1 小的小直径填料和平均粒径D 2 < / Sub>。小直径填料与大直径填料的平均一次粒径之比D 1 / D 2 为2×10 -4 to 3×10 -3 ,并且混合粉末的体积电阻率为2×10 10 Ω·m或更大。是的。此外,相对于100质量%的混合粉末,小直径填料的混合比例为0.5质量%至40质量%。此外,小直径填料粘附到大直径填料的外周表面,并且小直径填料以珠状形状连接在大直径填料之间的空隙中,从而形成三维网络结构。小直径填料造成的空隙。 [选择图]图1

著录项

  • 公开/公告号JP2020132827A

    专利类型

  • 公开/公告日2020-08-31

    原文格式PDF

  • 申请/专利权人 日本アエロジル株式会社;

    申请/专利号JP20190032263

  • 发明设计人 青木 昌雄;

    申请日2019-02-26

  • 分类号C08L101;H01B3;C08K3/013;H05K7/20;H01L23/36;H01L23/373;

  • 国家 JP

  • 入库时间 2022-08-21 11:37:30

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