Cu-Ni-Si copper alloy strip with excellent mold wear resistance

摘要

PROBLEM TO BE SOLVED: To provide a Cu—Ni—Si based copper alloy having excellent mold wear resistance. SOLUTION: In mass%, Ni: 2.0 to 5.0%, Si: 0.3 to 1.5%, Ni / Si ratio is 1.3 or more and 6.7 or less, and the balance is A Cu-Ni—Si copper alloy strip composed of Cu and unavoidable impurities and having a 0.2% resistance YS of 700 MPa or more, and the central part of the sample cut out to 5 × 15 mm in the longitudinal direction in the rolling parallel direction is formed into a plate. With a 5 mm square punch to a depth of thickness × 0.2, the sample is sandwiched outside the punch and pressed in the plate thickness direction toward the die facing the punch, and the cross section along the longitudinal direction is subjected to EBSD. When the crystal orientation is analyzed, the area ratio occupied by 111 // ND orientation is 3.0% or more. [Selection diagram] FIG.