首页> 外国专利> RESIN COMPOSITION, RESIN MOLDING, RESIN LAMINATE, CARTRIDGE, IMAGE FORMING APPARATUS, METHOD FOR PRODUCING RESIN MOLDING, METHOD FOR PRODUCING RESIN LAMINATE, AND METHOD FOR MANUFACTURING CARTRIDGE

RESIN COMPOSITION, RESIN MOLDING, RESIN LAMINATE, CARTRIDGE, IMAGE FORMING APPARATUS, METHOD FOR PRODUCING RESIN MOLDING, METHOD FOR PRODUCING RESIN LAMINATE, AND METHOD FOR MANUFACTURING CARTRIDGE

机译:树脂组成,树脂模制,树脂叠层,模架,图像形成装置,树脂模制方法,树脂叠层体的制造方法以及模架的制造方法

摘要

To solve the problem that it is difficult to achieve both high conductivity and moldability in a resin molding containing an ethylene-vinyl acetate copolymer resin and carbon black as main components.SOLUTION: A resin molding contains an ethylene-vinyl acetate copolymer resin and carbon black as main components. The ethylene-vinyl acetate copolymer resin has an MFR of 0.5 g/10 min or more and 20 g/10 min or less. The carbon black has an average primary particle diameter of 55 nm or more and 100 nm or less and a DBP oil absorption of 100 mL/100 g or more and 300 mL/100 g or less. The content of vinyl acetate is 2.9 pts.mass or more and 12.3 pts.mass or less based on 100 pts.mass of the main components. The resin molding has a surface resistivity of 720 Ω/sq. or less.SELECTED DRAWING: Figure 1
机译:为了解决在以乙烯-乙酸乙烯酯共聚物树脂和炭黑为主要成分的树脂成型品中难以兼顾高导电性和成型性的问题的解决方法:树脂成型品以乙烯-乙酸乙烯酯共聚物树脂和炭黑为主要成分作为主要组成部分。乙烯-乙酸乙烯酯共聚物树脂的MFR为0.5g / 10min以上且20g / 10min以下。炭黑的平均一次粒径为55nm以上且100nm以下,并且DBP吸油量为100mL / 100g以上且300mL / 100g以下。乙酸乙烯酯的含量基于主要成分的100质量%为2.9质量%以上且12.3质量%以下。树脂模制件的表面电阻率为720Ω/ sq。或更少。选定的图纸:图1

著录项

  • 公开/公告号JP2020012097A

    专利类型

  • 公开/公告日2020-01-23

    原文格式PDF

  • 申请/专利权人 CANON INC;

    申请/专利号JP20190094048

  • 发明设计人 YANE AKIRA;KURIHARA DAISUKE;

    申请日2019-05-17

  • 分类号C08J3/20;G03G15/08;G03G21/18;B29C69/02;

  • 国家 JP

  • 入库时间 2022-08-21 11:36:22

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