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CHIP INCLUDING MULTIPLE LIFT-OUT NEEDLES, MICROMANIPULATOR, AND SYSTEM FOR PREPARING MICROMANIPULATOR

机译:包括多个提升针的芯片,微操纵器以及用于准备微操纵器的系统

摘要

To provide a micromanipulator and a system that prepares a micromanipulator which facilitate exchange of a tip probe of a vacuum-compatible micromanipulator performing liftout and increase a system uptime.SOLUTION: In a chip having a plurality of rods that are formed apart from a base material 104 and are connected to each other at their respective longitudinal end portions, and includes a connector for holding the rods on the base material 104, each of the rods is individually lifted off the tip for use by a micromanipulator by cutting the rod from the connector at both first and second end portions.SELECTED DRAWING: Figure 2
机译:提供一种微操纵器和制备该微操纵器的系统,该系统有助于更换兼容真空的微操纵器的尖端探针,从而进行提升操作并增加系统正常运行时间。解决方案:一种芯片中具有多个与母材分开形成的杆104和104在其各自的纵向端部处彼此连接,并且包括用于将杆保持在基础材料104上的连接器,通过从连接器上切割杆,将每个杆单独地从尖端提起以供微操纵器使用。在第一个和第二个末端部分。图2

著录项

  • 公开/公告号JP2020057604A

    专利类型

  • 公开/公告日2020-04-09

    原文格式PDF

  • 申请/专利权人 FEI CO;

    申请/专利号JP20190176863

  • 发明设计人 BRIAN ROUTH JR;

    申请日2019-09-27

  • 分类号H01J37/317;B25J7;G01N1/28;H01J37/20;H01J37/305;

  • 国家 JP

  • 入库时间 2022-08-21 11:35:58

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