首页> 外国专利> Heat-modified polymer layer-inorganic base material composite, polymer member-inorganic base material composite, and method for producing them

Heat-modified polymer layer-inorganic base material composite, polymer member-inorganic base material composite, and method for producing them

机译:热改性聚合物层-无机基材复合体,聚合物构件-无机基材复合体及其制造方法

摘要

PROBLEM TO BE SOLVED: To provide a heat-modified polymer layer-inorganic base material composite, a polymer member-inorganic base material composite, and a method for producing them. The method of the present invention for producing a heat-denatured polymer layer-inorganic substrate composite 110, 120 forms a first polymer layer on an inorganic substrate 10 and heats the first polymer layer. The first heat-modified polymer layer 20 is brought into close contact with the inorganic substrate. Further, in the method of the present invention for producing the polymer member-inorganic base material composites 210 and 220, the heat-modified polymer layer-inorganic base material composite is produced by the method of the present invention, and the polymer member 30 is the first. Including bonding the polymer member to the first heat-modified polymer layer, such as bonding to the inorganic substrate via the heat-modified polymer layer of the above. [Selection diagram] Fig. 1
机译:解决的问题:提供热改性的聚合物层-无机基材复合体,聚合物构件-无机基材复合体及其制造方法。本发明的用于生产热变性聚合物层-无机基材复合材料110、120的方法在无机基材10上形成第一聚合物层并加热该第一聚合物层。使第一热改性聚合物层20与无机基板紧密接触。另外,在本发明的高分子构件-无机基材复合体210、220的制造方法中,通过本发明的方法制造热改性了的高分子层-无机基材复合体,高分子构件30为:首先。包括将聚合物构件结合至第一热改性聚合物层,例如经由上述热改性聚合物层结合至无机基材。 [选择图]图1

著录项

  • 公开/公告号JP2020163828A

    专利类型

  • 公开/公告日2020-10-08

    原文格式PDF

  • 申请/专利权人 帝人株式会社;

    申请/专利号JP20190170045

  • 发明设计人 添田 淳史;池田 吉紀;

    申请日2019-09-19

  • 分类号B32B37;B29C65/02;

  • 国家 JP

  • 入库时间 2022-08-21 11:36:01

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