NON-CONTACT TYPE UPPER/LOWER LAYER COPPER THICKNESS SURVEY METHOD APPLIED TO PCB MULTILAYER PLATE

摘要

PROBLEM TO BE SOLVED: To provide a non-contact type upper/lower layer copper thickness survey method applied to a PCB multilayer plate.;SOLUTION: A non-contact type upper/lower layer copper thickness survey method applied to a PCB multilayer plate includes: preparing a first detection unit provided on an upper layer of a PCB multilayer plate and a second detection unit provided on the lower layer thereof, in which the first and second detection units generate an induced electromotive force or electric field toward the upper/lower layer surface, the impedance of the metal surfaces of the upper layer and the lower layer form eddy current or a reflection signal, the first and second detection units survey the eddy current or reflection signal and acquires a first impedance value and a second impedance value, the eddy current or reflection signal of the upper layer and the lower layer generate reflected counter electromotive force or re-reflection signal, the first and second detection units surveys the counter electromotive force or re-reflection signal and acquires a third impedance value and a fourth impedance value, finally, a processing unit executes calculation of a thickness by the first, second third and fourth impedance values and acquires a first thickness of the upper layer and a second thickness of the lower layer.;SELECTED DRAWING: Figure 2;COPYRIGHT: (C)2020,JPO&INPIT