To provide an embedded type passive element structure.SOLUTION: An embedded type passive element structure includes: a first conductive metal layer; an electric resistance layer; a dielectric layer; a support layer; a bonding layer; and a second conductive metal layer. Specifically, a development and etching process is implemented to the embedded type passive element structure of the present invention at two times, and thereafter, an electronic circuit containing at least one thin film electric resistance element, at least one thin film inductance element, and at least one thin film capacitor element onto the embedded type passive element structure simultaneously. According to a layout of the present invention, the electric resistance layer is an electric resistance film made of an alloy, a metal, or a metal compound produced by a spattering technique. The electric resistance layer formed by the spattering has denseness and continuity higher coated film, and therefore, the minimum value of the surface resistance is lower than 5 ohmic/sq., or equals to them. Simultaneously therewith, the electric resistance film made of an alloy, a metal, or a metal compound produced by using the spattering technique can reduce effectively the generation of industrial waste water.SELECTED DRAWING: Figure 3
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