首页> 外国专利> MELTING AID FOR MOLECULAR ORGANIC CONDUCTOR, MOLECULAR ORGANIC CONDUCTOR-CONTAINING SOLID MATERIAL AND THEIR USE

MELTING AID FOR MOLECULAR ORGANIC CONDUCTOR, MOLECULAR ORGANIC CONDUCTOR-CONTAINING SOLID MATERIAL AND THEIR USE

机译:分子有机导体,含分子有机固体材料的熔融助剂及其用途

摘要

To provide means for melting a molecular organic conductor that was difficult to introduce into inkjet printing process due to its high melting point, at a temperature lower than the melting point of the molecular organic conductor.SOLUTION: Provided are: a melting aid for molecular organic conductor, containing crown ether and organic cation; and a solid material, containing molecular organic conductor anion, organic cation and crown ether. The organic cation is at least one cation selected from the group consisting of imidazolium cation, pyridinium cation, pyridazinium cation, pyrimidinium cation, pyrazinium cation and bipyridinium cation. The crown ether is selected from crown ethers having an inclusion ability for organic cation.SELECTED DRAWING: None
机译:提供一种用于熔化分子有机导体的方法,该方法由于熔点高而难以引入喷墨打印过程中,但其温度低于分子有机导体的熔点。解决方案:提供:用于分子有机的熔化助剂导体,含有冠醚和有机阳离子;固体材料,包含分子有机导体阴离子,有机阳离子和冠醚。有机阳离子是选自咪唑鎓阳离子,吡啶鎓阳离子,哒嗪鎓阳离子,嘧啶鎓阳离子,吡嗪鎓阳离子和联吡啶鎓阳离子的至少一种阳离子。冠醚选自具有对有机阳离子的包容能力的冠醚。

著录项

  • 公开/公告号JP2020033485A

    专利类型

  • 公开/公告日2020-03-05

    原文格式PDF

  • 申请/专利权人 HOKKAIDO UNIV;

    申请/专利号JP20180162355

  • 申请日2018-08-31

  • 分类号C09K3;C09D11/30;H01B1/12;

  • 国家 JP

  • 入库时间 2022-08-21 11:35:25

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