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Method for manufacturing a bonded body of a ceramic substrate and an aluminum-impregnated silicon carbide porous body

机译:陶瓷基板与铝浸渗碳化硅多孔体的结合体的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a bonded body of a ceramics substrate and an aluminum-impregnated silicon carbide porous body in which the manufacturing cost can be reduced while ensuring good bonding.SOLUTION: Provided is a method for manufacturing a bonded body of a ceramic substrate and an aluminum-impregnated silicon carbide porous body in which aluminum or an aluminum alloy is impregnated in a porous body made of silicon carbide. In the method, as a bonding material, a double sided brazing clad material in which a brazing material layer containing 3.0 mass% or less of magnesium on both surfaces of a core material made of an aluminum alloy is formed, is interposed between the ceramic substrate and the aluminum-impregnated silicon carbide porous body and heated to a bonding temperature in a non-oxidizing atmosphere.SELECTED DRAWING: Figure 1
机译:解决的问题:提供一种制造陶瓷基板与铝浸渍的碳化硅多孔体的结合体的方法,其中可以在确保良好结合的同时降低制造成本。解决方案:提供了一种制造结合体的方法。陶瓷基板的主体和将铝或铝合金浸渍在由碳化硅制成的多孔体中的铝浸渍的碳化硅多孔体中。在该方法中,作为接合材料,在陶瓷基板之间夹有在铝合金制的芯材的两面上形成含有3.0质量%以下的镁的钎料层的双面钎料复合材料。以及浸有铝的碳化硅多孔体并在非氧化性气氛中加热到粘结温度。图1

著录项

  • 公开/公告号JP6769169B2

    专利类型

  • 公开/公告日2020-10-14

    原文格式PDF

  • 申请/专利权人 三菱マテリアル株式会社;

    申请/专利号JP20160162125

  • 发明设计人 大開 智哉;大井 宗太郎;

    申请日2016-08-22

  • 分类号C04B37;B23K35/28;C22C21;B23K1;B23K1/19;C22C21/02;C22C21/06;B23K101/42;

  • 国家 JP

  • 入库时间 2022-08-21 11:35:11

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