首页> 外国专利> WICK, LOOP-TYPE HEAT PIPE, COOLING DEVICE, ELECTRONIC APPARATUS, POROUS BODY MANUFACTURING METHOD, AND WICK MANUFACTURING METHOD

WICK, LOOP-TYPE HEAT PIPE, COOLING DEVICE, ELECTRONIC APPARATUS, POROUS BODY MANUFACTURING METHOD, AND WICK MANUFACTURING METHOD

机译:芯棒,环状热管,冷却装置,电子设备,多孔体制造方法和芯棒制造方法

摘要

PROBLEM TO BE SOLVED: To provide a wick capable of further improving cooling performance of cooling means.;SOLUTION: A loop-type heat pipe 1 includes an evaporation portion 2 (heat receiving portion 7) changing a phase of a working fluid from a liquid phase to a gas phase, and a condensation portion 3 changing the phase of the working fluid from the gas phase to the liquid phase. A wick 6 used in the loop-type heat pipe 1 and disposed inside of the evaporation portion 2 is composed of a porous body. Bubbles existing on a cross-section obtained by cutting the porous body, have a dimension within a range of 0.1 [μm] or more and 50 [μm] or less, and composite bubbles formed by partially overlapping the spherical bubbles to each other, exist. The bubbles of pore diameters of 5 [μm] or more and 10 [μm] or less exist most in the composite bubbles, and a communication hole of 5 [μm] or less exists between the bubbles.;SELECTED DRAWING: Figure 5;COPYRIGHT: (C)2020,JPO&INPIT
机译:解决的问题:提供一种能够进一步改善冷却装置的冷却性能的灯芯。解决方案:环形热管1包括蒸发部分2(受热部分7),该蒸发部分2从液体改变工作流体的相冷凝部分3将工作流体的相从气相改变为液相。在环状热管1中使用并设置在蒸发部2的内部的芯子6由多孔体构成。存在于通过切割多孔体而获得的截面上的气泡,其尺寸在0.1 [μm]以上且50 [μm]以下的范围内,并且存在通过使球形气泡彼此部分重叠而形成的复合气泡。 。在复合气泡中最多存在孔径为5 [μm]至10 [μm]以下的气泡,并且在气泡之间存在5 [μm]以下的连通孔。选定的附图:图5;版权:(C)2020,JPO&INPIT

著录项

  • 公开/公告号JP2020020495A

    专利类型

  • 公开/公告日2020-02-06

    原文格式PDF

  • 申请/专利权人 RICOH CO LTD;

    申请/专利号JP20180142655

  • 申请日2018-07-30

  • 分类号F28D15/04;F28D15/02;F28F21/06;H01L23/427;H05K7/20;

  • 国家 JP

  • 入库时间 2022-08-21 11:35:02

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