ALUMINA ABRASIVE GRAINS FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF MANUFACTURING THE SAME

摘要

To provide alumina abrasive grains for chemical mechanical polishing which suppress an occurrence of a polishing scratch while polishing a surface to be polished at high speed in chemical mechanical polishing performed when forming wiring of semiconductor devices and has excellent dispersion stability in a composition.SOLUTION: The alumina abrasive grains for chemical mechanical polishing has at least a part of a surface coated with a film of a silane compound. In the alumina abrasive grains, when the number of moles of silicon is denoted as Mand the number of moles of aluminum is denoted as M, a value of M/Mis 0.01 or more and 0.2 or less. In a range where an incident angle in a powder X-ray diffraction pattern is 25° or more and 75° or less, the half value width of a peak portion where diffraction intensity is maximum is 0.3° or more and 0.5° or less.SELECTED DRAWING: Figure 1