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Plasma processing apparatus and analysis method for analyzing plasma processing data

机译:用于分析等离子体处理数据的等离子体处理装置和分析方法

摘要

According to the present invention, a plasma processing apparatus includes an analysis unit that obtains wavelengths of the light correlated with a plasma processing result, selects, from the obtained wavelengths, a wavelength having a first factor that represents a deviation in an intensity distribution of the light and is larger than a first predetermined value, and predicts the plasma processing result using the selected wavelength, or an analysis unit that obtains values computed using each of light intensities of a plurality of wavelengths and correlated with the plasma processing result, selects, from the obtained values, a value having a second factor that represents a deviation in a distribution of the obtained values and is larger than a second predetermined value, and predicts the plasma processing result using the selected value.
机译:根据本发明,等离子体处理设备包括分析单元,该分析单元获得与等离子体处理结果相关的光的波长,并从所获得的波长中选择具有第一因子的波长,该第一因子表示光的强度分布的偏差。并从大于第一预定值的光中选择并使用所选择的波长来预测等离子体处理结果,或者从获得了使用多个波长的光强度中的每一个与等离子体处理结果相关联的值的分析单元来从中选择获得的值是具有第二因子的值,该第二因子表示获得的值的分布的偏差并且大于第二预定值,并且使用所选择的值来预测等离子体处理结果。

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