Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device

摘要

The invention provides, for excellent bendability and softening-resistance, a copper foil for flexible printed circuit, a copper clad laminate using the same, a flexible printed circuit, and an electronic device. The copper foil includes more than 99.0 mass% of Cu and the balanced being unavoidable impurities. The copper foil includes one or more than two the following elements, respectively, 0.0005 mass% or more and 0.03 mass% or less of P, 0.0005 mass% or more and 0.05 mass% or less of Ag, 0.0005 mass% or more and 0.14 mass% or less of Sb, 0.0005 mass% or more and 0.163 mass% or less of Sn,0.0005 mass% or more and 0.288 mass% or less of Ni, 0.0005 mass% or more and 0.058 mass% or less of Be, 0.0005 mass% or more and 0.812 mass% or less of Zn, 0.0005 mass% or more and 0.429 mass% or lessof In, and 0.0005 mass% or more and 0.149 mass% or less of Mg. The copper foil has a semi-softening temperature of 160 to 300 DEG C. When the intensity, obtained by X-ray diffraction on the rolled surface, of the surface (200) is I and the intensity, obtained by X-ray diffraction, of the fine powder copper is I0, (I/I0) is 3.0 or less.