Method for removing precious metal-containing dissimilar metal multilayer film and method for recovering precious metal

摘要

PROBLEM TO BE SOLVED: To provide a removal method of an attachment of semiconductor production device parts, which can remove a multilayered film (attachment) where metal containing a plurality of kinds of precious metals attached to parts of a semiconductor production device are laminated in several tens of layers and which does not generate damage of a host material.SOLUTION: A removal method of precious metal-containing heterogeneous metal multilayered film includes a step of removing the precious metal-containing heterogeneous metal multilayered film attached to the semiconductor production device parts by wet etching, while dipping the semiconductor production device parts to which the precious metal-containing heterogeneous metal multilayered film containing a layer of a plurality of precious metals or precious metal alloys are adhered in an etching liquid that dissolves the precious metal, and also irradiating ultrasonic.SELECTED DRAWING: Figure 2