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Work separation device and work separation method

机译:分工装置及分工方法

摘要

The purpose of the present invention is to easily peel a support body off a workpiece by irradiating the support body with uniform laser light regardless of the size of a laminated body and the thickness of the workpiece. A workpiece separation device according to the present invention is characterized in that: the workpiece separation device is provided with a holding member for attachably/detachably holding a workpiece in a laminated body in which the workpiece, including a circuit board, and a support body that transmits laser light are laminated with a separation layer interposed therebetween, said separation layer becoming peelable at least by absorbing laser light, a light radiation unit for radiating laser light towards the separation layer through the support body of the laminated body held by the holding member, a drive unit for relatively moving, at least in a direction intersecting the direction of light radiated from the light radiation unit, the position of light that is radiated from the light radiation unit to the support body and the separation layer of the laminated body held by the holding member, and a control unit for controlling the operation of the light radiation unit and the drive unit; the light radiation unit has a laser scanner for moving the optical axis of spot-shaped laser light generated by a light source comprising a laser oscillator and is configured to sweep relative to the laminated body; the entire radiation surface of the separation layer irradiated with light from the light radiation unit is partitioned into a plurality of radiation areas; and the control unit performs control so that one radiation area of the plurality of radiation areas is filled entirely with many beams of laser light without a gap by arranging, at least through the operation of the laser scanner, radiation of laser light from the light radiation unit to the one radiation area of the plurality of radiation areas in two directions intersecting the light radiation direction, and thereafter irradiating the next radiation area with laser light is repeated in the same manner, thus eventually irradiating all of the plurality of radiation areas.
机译:发明内容本发明的目的是通过不考虑层叠体的尺寸和工件的厚度而通过用均匀的激光照射支撑体来容易地将支撑体从工件上剥离的方法。根据本发明的工件分离装置,其特征在于:所述工件分离装置具备用于将工件可装卸自如地保持在层叠体内的保持部件,所述层叠体中,所述工件包括电路基板,以及支撑体。透射激光被层压而在其间具有分隔层,所述分隔层至少通过吸收激光而变得可剥离,光辐射单元用于通过由保持构件保持的层压体的支撑体朝着分离层辐射激光,驱动单元,该驱动单元至少在与从光辐射单元辐射的光的方向相交的方向上相对移动,该光位置从光辐射单元辐射到支撑体和由其保持的层叠体的分离层保持部件,以及用于控制光辐射单元和驱动器的操作的控制单元单位所述光辐射单元具有激光扫描仪,所述激光扫描仪用于使由包括激光振荡器的光源产生的点状激光的光轴移动,并且相对于所述层叠体进行扫描。来自光照射单元的光所照射的分离层的整个照射面被划分为多个照射区域。控制单元进行控制,使得至少通过激光扫描仪的操作来布置来自光辐射的激光的辐射,从而多个辐射区域中的一个辐射区域完全被许多激光束无间隙地填充。在与光辐射方向相交的两个方向上,对多个辐射区域中的一个辐射区域进行单元辐射,然后以相同的方式重复对激光辐射下一个辐射区域,从而最终辐射所有多个辐射区域。

著录项

  • 公开/公告号JP6764552B2

    专利类型

  • 公开/公告日2020-09-30

    原文格式PDF

  • 申请/专利权人 信越エンジニアリング株式会社;

    申请/专利号JP20200519952

  • 发明设计人 大谷 義和;富岡 恭平;

    申请日2019-05-17

  • 分类号H01L21/02;H01L21/304;H01L21/683;B23K26/08;B23K26/082;B23K26/57;

  • 国家 JP

  • 入库时间 2022-08-21 11:33:15

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