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APPARATUS FOR DYNAMIC TEMPERATURE CONTROL AND METHOD FOR DYNAMIC TEMPERATURE CONTROL

机译:动态温度控制装置和动态温度控制方法

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for dynamic temperature control and a method for dynamic temperature control which flow air in a chassis and avoid thermal runaway between an arithmetic module and another component in the chassis.;SOLUTION: An apparatus for dynamic temperature control used for dynamic heat energy control comprises: a fan module 240 comprising a plurality of fan units; a deflection member 260 configured to direct airflow received from the fan module; and system components 220 and 225. The apparatus also includes a chassis management controller (CMC) 270, where the chassis management controller is coupled to the fan module, the deflection member, and the system component. The chassis management controller is configured to dynamically control the deflection member so as to direct airflow from the fan module to the system component by accounting for at least one environmental element within the apparatus.;SELECTED DRAWING: Figure 3;COPYRIGHT: (C)2020,JPO&INPIT
机译:要解决的问题:提供一种用于动态温度控制的设备和一种用于动态温度控制的方法,该方法可以使空气在机箱中流动,并避免算术模块与机箱中另一个组件之间的热失控。用于动态热能控制的装置包括:风扇模块240,包括多个风扇单元;偏转构件260,被配置为引导从风扇模块接收的气流;装置还包括机箱管理控制器(CMC)270,其中机箱管理控制器耦合到风扇模块,偏转构件和系统组件。机箱管理控制器配置为动态控制偏转部件,以便通过考虑设备中的至少一个环境元素将气流从风扇模块引导到系统组件。选定的图纸:图3;版权:(C)2020 ,JPO&INPIT

著录项

  • 公开/公告号JP2019220150A

    专利类型

  • 公开/公告日2019-12-26

    原文格式PDF

  • 申请/专利权人 QUANTA COMPUTER INC;

    申请/专利号JP20190078364

  • 发明设计人 YO SHII;

    申请日2019-04-17

  • 分类号G06F1/20;H05K7/20;G06F1/3203;G05D23/19;

  • 国家 JP

  • 入库时间 2022-08-21 11:33:11

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