The invention aims to provide a resin molding apparatus of fluid resin which capable of reducing a resin thickness deviation of a molded product. To achieve the purpose, the resin molding apparatus is characterized in that the device contains a coating mechanism (520) for coating fluid resin for resin molding in a coating area on a coating object (11) and a compression molding mechanism (520) for using the coating object (11) coated with the fluid resin through the coating mechanism (520) to perform compression molding, wherein the coating mechanism (520) includes a resin discharge mechanism for discharging the fluid resin in at least part of the coating area, and a resin expanding mechanism applying force to the fluid resin discharged by the resin discharge mechanism to expand the fluid resin.
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