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Laser microdissection device, analyzer including the laser microdissection device, and method for manufacturing microchip
Laser microdissection device, analyzer including the laser microdissection device, and method for manufacturing microchip
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机译:激光显微切割装置,包括该激光显微切割装置的分析仪以及制造微芯片的方法
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摘要
Provided is a specimen collection device capable of improving spatial resolution while using a conventional analysis device as is. The provided laser microdissection device is characterized by containing: a specimen movement means on which a specimen is mountable and capable of moving the specimen in the horizontal direction; a thermoplastic-film movement means on which a thermoplastic film is mountable and capable of moving the thermoplastic film in the vertical and horizontal directions; a laser irradiation unit for irradiating the specimen with a dissection laser beam, cutting away the specimen section irradiated by the dissection laser beam, and adhering the same as a collected specimen to the thermoplastic film; a storage means for associating and storing the positional coordinates of the specimen section to be irradiated by the dissection laser beam and the positional coordinates of the section of the thermoplastic film to which the collected specimen is to be adhered; and a movement-means drive control unit for driving and controlling the specimen movement means and the thermoplastic-film movement means, on the basis of the positional coordinates of the specimen and the positional coordinates of the thermoplastic film which are stored in the storage means.
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