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Separated chip solution for die-to-die SerDes
Separated chip solution for die-to-die SerDes
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机译:芯片对芯片SerDes的分离芯片解决方案
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摘要
A SoC integrated circuit package is provided in which the SerDes analog component for the SoC die in the SoC integrated circuit package is separated into a SerDes interface die in the SoC integrated circuit package. [Selection diagram] FIG. 2A
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