PRETREATMENT COMPOSITION FOR ELECTROLESS PLATING, PRETREATMENT METHOD FOR ELECTROLESS PLATING, AND ELECTROLESS PLATING METHOD

摘要

To provide a pretreatment composition for electroless plating, a pretreatment method for electroless plating, and an electroless plating method that can ensure high plating deposition without using harmful chromate or expensive palladium, and can reduce the number of steps.SOLUTION: A pretreatment composition for electroless plating containing 10 mg/L or more of persulfuric acid ions and 10 mg/L or more of monovalent silver ions is brought into contact with a target surface of a resin material at higher than 60°C, and the target surface of the resin material is further brought into contact with an electroless plating liquid.SELECTED DRAWING: None