Resin material for forming lower layer film, resist lower layer film, method for producing resist lower layer film, and laminate

摘要

The resin material for forming an underlayer film of the present invention is a resin material for forming an underlayer film for forming a resist underlayer film used in a multi-layer resist process, containing a cyclic olefin polymer (I), and using a rheometer to obtain nitrogen. Storage elastic modulus (G ′) in solid viscoelasticity of the above resin material for forming an underlayer film measured in an atmosphere in a shear mode, a measurement temperature range of 30 to 300 ° C., a heating rate of 3 ° C./min, and a frequency of 1 Hz. The temperature at which the curve intersects the loss modulus (G ″) curve is 40 ° C. or higher and 200 ° C. or lower.