Method for forming electric Ni-PB-based plating film, said film, and sliding member provided with said film

摘要

The method for forming a Ni-P-B-based plating film includes a secondary brightener including Ni ion, phosphite ion, alkylamine borane, acetic acid, at least one primary brightener, and at least one surfactant. Electroplating is performed in a plating bath. In the above plating bath, the concentration of alkylamine borane is 1.37 mmol / L or more, and the concentration of acetic acid is 0.70 mol / L or more and less than 2.80 mol / L. Thereby, even if the current density is increased to 80 A / dm2 or more and the film formation rate is increased, occurrence of appearance defects such as burns and abnormal deposition is reduced, and a plating film having a high hardness of Hv700 or more without baking treatment is provided. Can be formed with high production efficiency.