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Systems and methods for dicing samples using a bessel beam matrix

机译:使用贝塞尔光束矩阵对样品进行切割的系统和方法

摘要

Systems and methods for dicing a sample by a Bessel beam matrix are disclosed. The method for dicing a sample by a Bessel beam matrix may comprise generating a Bessel beam matrix including multiple Bessel beams arranged in a matrix form, according to a predetermined dicing layout of the sample; controlling a focus position of each Bessel beam in the generated Bessel beam matrix; and focusing simultaneously the Bessel beams of the Bessel beam matrix at the respective controlled focus positions within the sample for dicing.
机译:公开了用于通过贝塞尔光束矩阵切割样品的系统和方法。通过贝塞尔光束矩阵切割样品的方法可以包括:根据样品的预定切割布局,生成包括以矩阵形式布置的多个贝塞尔光束的贝塞尔光束矩阵;控制所产生的贝塞尔光束矩阵中每个贝塞尔光束的聚焦位置;将贝塞尔光束矩阵的贝塞尔光束同时聚焦在样品内各个受控焦点位置处进行切割。

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