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Low thermal expansion superalloy and manufacturing method thereof

机译:低热膨胀合金及其制造方法

摘要

A low thermal expansion superalloy is composed of, in mass %, 0.1% or less of C, 0.1-1.0% of Si, 1.0% or less of Mn, 25-32% of Ni, more than 18% but less than 24% of Co, more than 0.25% but 1.0% or less of Al, 0.5-1.5% of Ti, more than 2.1% but less than 3.0% of Nb, 0.001-0.01% of B and 0.0005-0.01% of Mg, with the balance of Fe and unavoidable impurities, while satisfying Mg/S≥1, 52.9≤1.235Ni+Co55.8%, (Al+Ti+Nb) is 3.5-5.5%, and the F value is 8% or less. In the superalloy, a granular intermetallic compound containing Si, Nb, and Ni alone or in a total amount of 36 mass % or more is precipitated at a grain boundary of an austenite matrix, and an intermetallic compound including a larger concentration of Ni, Al, Ti, and Nb and having 50 nm or smaller of an average diameter is precipitated in the austenite matrix.
机译:低热膨胀高温合金以质量%计包括0.1%或更少的C,0.1-1.0%的Si,1.0%或更少的Mn,25-32%的Ni,大于18%但小于24%的合金。 Co,Al的0.25%以上但1.0%以下,Ti的0.5-1.5%以下,Nb的2.1%以上且不足3.0%,B的0.001-0.01%和Mg的0.0005-0.01%的条件下,在满足Mg /S≥1的同时,Fe和不可避免的杂质的余量为52.9≤1.235Ni+ Co <55.8%,(Al + Ti + Nb)为3.5-5.5%,F值为8%以下。在该高温合金中,在奥氏体基体的晶界处析出仅含有Si,Nb和Ni或合计量为36质量%以上的粒状的金属间化合物,并且,含有较高浓度的Ni,Al的金属间化合物。平均直径为50nm以下的Ti,Ti和Nb析出在奥氏体基体中。

著录项

  • 公开/公告号US10633717B2

    专利类型

  • 公开/公告日2020-04-28

    原文格式PDF

  • 申请/专利权人 HITACHI METALS LTD.;

    申请/专利号US201615763617

  • 发明设计人 TOSHIHIRO UEHARA;NAOYA SATO;

    申请日2016-07-29

  • 分类号C21D6;C22B9/04;C22C38/14;C22C38/02;C22C38/12;F01D25/26;F01D5/28;C21D6/02;F01D25;C21D8/02;C22C38;C22C38/04;C22C38/10;C22C30;

  • 国家 US

  • 入库时间 2022-08-21 11:28:42

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