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Thin electronic package elements using laser spallation
Thin electronic package elements using laser spallation
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机译:使用激光剥落的薄电子封装元件
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摘要
Discussed generally herein are methods and devices for flexible fabrics or that otherwise include thin traces. A device can include a flexible polyimide material, and a first plurality of traces on the flexible polyimide material, wherein the first plurality of traces are patterned on the flexible polyimide material using laser spallation.
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