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Multilayer stack with enhanced conductivity and stability

机译:具有增强的导电性和稳定性的多层堆叠

摘要

An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.
机译:一种示例方法包括:(i)在衬底上沉积绝缘层; (ii)在绝缘层上形成导电聚合物层; (iii)重复沉积相应的绝缘层,以及形成相应的导电聚合物层,以形成插入相应绝缘层之间的相应导电聚合物层的多层堆叠。每个相应的导电聚合物层具有相应的电阻,使得当相应的导电聚合物层并联连接到电源时,相应的导电聚合物层的合成电阻小于每个相应的电阻。

著录项

  • 公开/公告号US10541065B2

    专利类型

  • 公开/公告日2020-01-21

    原文格式PDF

  • 申请/专利权人 THE BOEING COMPANY;

    申请/专利号US201715851002

  • 申请日2017-12-21

  • 分类号H01B1/12;H01C7;H01C17/065;H01C17/24;H05B3/14;H01C17/26;H01C7/18;H01C1/16;H01B1/22;H01B1/24;H01B3;H01B7/02;B64D45/02;H01C7/02;H01C17/28;B64D15/12;H01C1/142;

  • 国家 US

  • 入库时间 2022-08-21 11:27:21

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