Buffer Defense Band (BDB) Outside the Seal Ring to Enhance Crack Stopping in IC's

摘要

A plurality of prime dies are fabricated on a wafer. A plurality of frame structures are fabricated in vertical scribe lines separating the prime dies from one another. A plurality of test structures are fabricated in horizontal scribe lines separating the prime dies from one another. A seal ring is fabricated surrounding each of the prime dies. A buffer defense band is provided on the outside of each seal ring and extending from the seal ring to all borders of each of the prime dies. The prime dies are diced on the vertical scribe lines and on the horizontal scribe lines wherein the buffer defense band improves the robustness of the IC packaging window to prevent any cracks, chipping, or delaminating originating from any horizontal or vertical scribe lines from propagating into any of the prime dies.