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Method of direct wafer mapping by determining operational LEDs from non-operational LEDs using photo-reactive elastomer deposition
Method of direct wafer mapping by determining operational LEDs from non-operational LEDs using photo-reactive elastomer deposition
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机译:通过使用光反应性弹性体沉积从非工作LED确定工作LED来进行直接晶圆映射的方法
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摘要
LEDs are manufactured on a substrate layer and picked and placed using a pick-up tool (PUT) onto a target substrate. The PUT typically attaches to an LED via an elastomer layer deposited on a surface of the LED. A given batch of manufactured LEDs may contain operational LEDs as well as non-operational LEDs. In order to separate the operational and non-operational LEDs, the LEDs are placed on a unidirectional conductive film. A photo-curable polymer is deposited on a surface of each LED. A voltage difference is applied across the electrodes of each LED via the unidirectional conductive film, causing the operational LEDs to emit light and cure the photo-curable polymer to form an elastomer layer, while the polymer deposited on the non-operational LEDs will not cure. As such, the PUT will be able to pick up the operational LEDs, while being unable to pick up the non-operational LEDs.
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