首页> 外国专利> Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methods

Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methods

机译:在装配配对件上产生连接介质的方法,在装配配对件和金属层之间产生材料配合连接的方法以及执行该方法的系统

摘要

A method for producing a layer including a connecting medium on an assembly partner is provided. The method includes providing a carrier on which the connecting medium is applied. The connecting medium contains a metal in the form of a multiplicity of metal particles. The assembly partner is placed on the connecting medium located on the carrier and pressed onto the connecting medium located on the carrier, so that a layer of the connecting medium adheres to the assembly partner. The assembly partner together with the layer adhering thereto is removed from the carrier. By means of a gas flow, edges of the layer, at which the latter extends laterally beyond the assembly partner, are removed so that a layer residue of the layer remains adhering to the assembly partner.
机译:提供了一种用于在组装伙伴上制造包括连接介质的层的方法。该方法包括提供在其上施加连接介质的载体。连接介质包含多种金属颗粒形式的金属。将组装伙伴放置在位于载体上的连接介质上,并压在位于载体上的连接介质上,以使一层连接介质粘附到组装伙伴上。将组装伙伴及其粘附的层从载体上移除。通过气流,去除了该层的边缘,在该边缘处侧向延伸超过装配配对物,使得该层的层残留物保持粘附到装配配对物上。

著录项

  • 公开/公告号US10615138B2

    专利类型

  • 公开/公告日2020-04-07

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号US201615010727

  • 申请日2016-01-29

  • 分类号H01L23;H01L23/373;B23K1;B23K1/018;B23K35/02;B23K35/30;

  • 国家 US

  • 入库时间 2022-08-21 11:26:21

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