THERMAL MANAGEMENT SOLUTIONS USING SELF-HEALING POLYMERIC THERMAL INTERFACE MATERIALS
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机译:使用自修复聚合物热界面材料的热管理解决方案
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摘要
A thermal interface material may be formed comprising a polymer material and a self-healing constituent. The thermal interface material may be used in an integrated circuit assembly between at least one integrated and a heat dissipation device, wherein the self-healing constituent changes the physical properties of the thermal interface material in response to thermo-mechanical stresses to prevent failure modes from occurring during the operation of the integrated circuit assembly.
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