A radio frequency (RF) antenna array for an RF printed circuit board (RF-PCB) having a PCB ground layer includes an interposer assembly, conductive pillars, and load element. The interposer assembly includes a substrate, a ground layer defining one or more apertures, a dielectric layer, and a microstrip trace. The substrate is spaced apart from the RF-PCB. The interposer ground layer is deposited onto the substrate. The dielectric layer is deposited onto the interposer ground layer. The microstrip trace, positioned on the dielectric layer, receives and directs incident RF energy along the longitudinal axis. The pillars electrically connect the ground layers and structurally support the substrate, such that RF energy along the trace couples to the upper surface of the interposer assembly through the aperture(s). The load element connects in series to the microstrip trace at a distal/terminal end of the array.
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