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THERMALLY ENHANCED PACKAGE TO REDUCE THERMAL INTERACTION BETWEEN DIES
THERMALLY ENHANCED PACKAGE TO REDUCE THERMAL INTERACTION BETWEEN DIES
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机译:热增强包装以减少模具之间的热相互作用
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摘要
A method of reducing heat flow between IC chips and the resulting device are provided. Embodiments include attaching plural IC chips to an upper surface of a substrate; forming a lid over the IC chips; and forming a slit through the lid at a boundary between adjacent IC chips.
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