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IN-LINE LED LAMP BEAD AND PACKAGING PROCESS THEREOF

机译:直插式LED灯珠及其包装工艺

摘要

The invention relates to the technical field of the packaging process of LEDs, and discloses an in-line LED lamp bead and the packaging process thereof. A LED lamp bead, comprising a colloid and a bracket embedded in the colloid; a chip is mounted on the bracket; the bracket is provided with 1-4 pins that pass out of the colloid; the chip is electrically connected to the pin; the phosphor powder is dispersed in the illuminant; The invention also discloses a packing process of the in-line LED lamp bead, comprising the steps of die bonding, wire welding, glue filling, pin cutting and light splitting. The LED lamp bead of the invention has the advantageous as simple structure, low production cost, high yield rate of the products, long service life of LED lamp bead, and the LED lamp bead can emit light over 360 degrees.
机译:本发明涉及LED封装工艺技术领域,公开了一种直插式LED灯珠及其封装工艺。一种LED灯珠,包括胶体和嵌入该胶体中的支架;支架上装有芯片;支架上有1-4个从胶体中伸出的销钉。芯片电连接至引脚。荧光粉散布在发光体中。本发明还公开了一种直插式LED灯珠的包装工艺,包括芯片粘接,引线焊接,灌胶,插针切割和分光的步骤。本发明的LED灯珠具有结构简单,生产成本低,产品合格率高,LED灯珠使用寿命长的优点,并且LED灯珠可以发光360度以上。

著录项

  • 公开/公告号US2020227599A1

    专利类型

  • 公开/公告日2020-07-16

    原文格式PDF

  • 申请/专利权人 YONGJIN YANG;

    申请/专利号US201916388848

  • 发明设计人 YONGJIN YANG;

    申请日2019-04-18

  • 分类号H01L33/50;H01L33/62;H01L33/56;

  • 国家 US

  • 入库时间 2022-08-21 11:25:07

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