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FIBER WEAVE SKEW ASSESSMENT FOR PRINTED CIRCUIT BOARDS
FIBER WEAVE SKEW ASSESSMENT FOR PRINTED CIRCUIT BOARDS
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机译:印刷电路板的纤维编织偏斜评估
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摘要
In one embodiment, a method includes inspecting a layer of a printed circuit board through an inspection window comprising an opening formed in one or more other layers of the printed circuit board and identifying a location of a trace aligned with the inspection window, relative to a marker in a fiber bundle of a fiber weave to assess fiber weave skew.
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