CHEMICAL-MECHANICAL POLISHING SOLUTION HAVING HIGH SILICON NITRIDE SELECTIVITY

摘要

A chemical-mechanical polishing slurry having high Silicon Nitride removal rate selectivity includes abrasive particles and a compound containing one or more carboxyl groups. The polishing slurry has high SiN removal rate, low TEOS removal rate, and high removal rate selectivity of SiN to TEOS. The polishing slurry can significatntly reduce the defects on Oxide surface which has an excellent market application prospect.