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METHOD OF AND ATOMIC FORCE MICROSCOPY SYSTEM FOR PERFORMING SUBSURFACE IMAGING

机译:进行表面下成像的方法和原子显微系统

摘要

The document relates to a method of performing subsurface imaging of embedded structures underneath a substrate surface, using an atomic force microscopy system. The system comprises a probe with a probe tip, and a sensor for sensing a position of the probe tip. The method comprises the steps of: positioning the probe tip relative to the substrate: applying a first acoustic input signal to the substrate; applying a second acoustic input signal to the substrate; detecting an output signal from the substrate in response to the first and second acoustic input signal; and analyzing the output signal. The first acoustic input signal comprises a first signal component and a second signal component, the first signal component comprising a frequency below 250 megahertz and the second signal component either including a frequency below 2.5 megahertz or a frequency such as to provide a difference frequency of at most 2.5 megahertz with the first signal component, such as to enable analysis of an induced stress field in the substrate; and wherein the second acoustic input signal comprises a third signal component having a frequency above 1 gigahertz, such that the return signal includes a scattered fraction of the second acoustic input signal scattered from the embedded structures. This enables to perform imaging a various depths in one pass, across a large range of depths.
机译:该文件涉及一种使用原子力显微镜系统在衬底表面下方对嵌入式结构进行地下成像的方法。该系统包括具有探针尖端的探针和用于感测探针尖端位置的传感器。该方法包括以下步骤:相对于基底定位探针尖端;向基底施加第一声输入信号;以及将第一声输入信号施加于基底。向基板施加第二声输入信号;响应于第一和第二声学输入信号,检测来自基板的输出信号;并分析输出信号。第一声​​音输入信号包括第一信号分量和第二信号分量,第一信号分量包括低于250兆赫兹的频率,第二信号分量包括低于2.5兆赫兹的频率或诸如提供差频为的频率。带有第一个信号分量的最大2.5兆赫,以便能够分析基板中的感应应力场;并且其中第二声音输入信号包括具有高于1GHz的频率的第三信号分量,使得返回信号包括从嵌入式结构散射的第二声音输入信号的散射部分。这使得能够在大范围的深度中一次通过成像各种深度。

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