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CREATING 3D FEATURES THROUGH SELECTIVE LASER ANNEALING AND/OR LASER ABLATION
CREATING 3D FEATURES THROUGH SELECTIVE LASER ANNEALING AND/OR LASER ABLATION
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机译:通过选择性激光退火和/或激光烧蚀创建3D功能
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摘要
A semiconductor device includes a solder supporting material above a substrate. The semiconductor device also includes a solder on the solder supporting material. The semiconductor device further includes selective laser annealed or laser ablated portions of the solder and underlying solder supporting material to form a semiconductor device having 3D features.
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