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MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREVENT STRUCTURAL FAILURE OF SEMICONDUCTOR WAFERS
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREVENT STRUCTURAL FAILURE OF SEMICONDUCTOR WAFERS
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机译:缓解水分驱动的功能退化,这些功能旨在防止半导体晶片的结构故障
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摘要
Moisture-driven degradation of a crack stop in a semiconductor die is mitigated by forming a groove in an upper surface of the die between an edge of the die and the crack stop; entirely filling the groove with a moisture barrier material; preventing moisture penetration of the semiconductor die by presence of the moisture barrier material; and dissipating mechanical stress in the moisture barrier material without presenting a stress riser in the bulk portion of the die. The moisture barrier material is at least one of moisture-absorbing, moisture adsorbing, and hydrophobic.
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