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Millimeter Wave Impedance Matching Structures

机译:毫米波阻抗匹配结构

摘要

An electronic device may be provided with a transceiver, a substrate, and antennas mounted to the substrate. The transceiver and antennas may convey signals between 10 GHz and 300 GHz. A radio-frequency connector may be mounted to the substrate. A coaxial cable may couple the transceiver to the connector. A stripline in the substrate may couple the connector to the antennas. Impedance matching structures may be embedded in the substrate for matching an impedance of the stripline to an impedance of the coaxial cable. The impedance matching structures may include a fence of conductive vias, landing pads, and a volume of the dielectric substrate defined by the fence of conductive vias and the landing pads. The impedance matching structures may be configured to perform impedance matching over a relatively wide bandwidth that includes the frequency band of operation for the antennas.
机译:电子设备可以具有收发器,基板以及安装到基板的天线。收发器和天线可以传送10 GHz至300 GHz之间的信号。射频连接器可以安装到基板。同轴电缆可以将收发器耦合到连接器。基板中的带状线可将连接器耦合到天线。阻抗匹配结构可以嵌入在基板中,以使带状线的阻抗与同轴电缆的阻抗匹配。阻抗匹配结构可以包括导电通孔的栅栏,接合垫以及由导电通孔的栅栏和接合垫限定的介电基板的体积。阻抗匹配结构可以被配置为在包括天线的工作频带在内的相对较宽的带宽上执行阻抗匹配。

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